Revolutionizing Heat Dissipation with Advanced Diamond Technology
Anjali Semicon is thrilled to participate in CIME – The 13th Shanghai Heat Conduction & Heat Dissipation Materials Expo 2024. Visit us at Booth B92 to discover our full range of cutting-edge diamond-based solutions for thermal management and semiconductor applications.
Explore our offerings:
Single Crystal Diamond Wafers
Poly Crystal Diamond Wafers
Diamond Semiconductor Substrates
Diamond Heat Sinks
Diamond Heat Spreaders
Experience how our advanced diamond materials deliver unmatched thermal conductivity, reliability, and performance for next-generation technologies. Meet our team of experts and learn how we’re redefining the future of heat dissipation and conduction.
Event Details:
Venue: Shanghai
Booth: B92
Dates: 18-20 December 2024
Be part of the innovation at CIME 2024 and let’s shape the future together!